Cicor Group: White Papers

Advanced thin-film substrates in Cu-AlN technology
Friday, March 16, 2018 For applications dealing with high power, like laser diodes or RF amplifiers, thermal management is a crucial topic. Thus, for packaging of these devices, high thermal...

Cicor Group - An ideal partner
Monday, April 07, 2014 Able to draw upon an extensive technology portfolio, not to mention in-house human capital, Cicor Group is a sought-after partner within the global electronics industry. Pascal...

Custom services from a single supplier
Friday, December 11, 2015 Cicor Group is renowned for its efficient and cutting-edge production of custom microelectronics and substrates, and its capability to provide a range of services as one supplier....

Design rules
Friday, March 16, 2018 Protective coatings for electronic printed circuit board assemblies.

Experience the difference of outsourcing
Friday, October 31, 2014 Smaller companies with bright ideas are turning to outsourcing for the manufacture of their products to accomplish things they can’t on their own. Robert MacKenzie, product manager...

Femtosecond laser in micro production
Friday, March 16, 2018 Thin film micro manufacturing at its best: State-of-the-art laser ,machining utilising ultra-short-pulse.

Film star
Thursday, June 04, 2015 The Cicor Group is a leading manufacturer of microelectronics and high-quality substrates, and a one-stop shop for electronic and plastic technology. Philippe Koller,...

Proof in practice
Tuesday, December 02, 2014 The design and manufacturing of medical electronics is undergoing a revolution, motivated predominantly by miniaturisation. Tommy Ong and Erich Trinkler from Cicor discuss the...

Right out of the box
Thursday, May 12, 2016 CEO of Cicor Dr Jürg Dübendorfer explains why the company is so well placed to support OEMs with the complete production of devices, from early development through to delivery.

Small but powerful
Monday, October 31, 2016 To integrate the required level of functions, printed-circuit-board technology has to allow a high density of integrated functions – a feat made possible by Cicor Group’s DenciTec platform.

Technology for medical human implants
Friday, March 16, 2018 Increasing complexity of today?s electrical circuits? lead to a growing demand for thin film “interface” substrates. Such substrates provide an important link between...

Ultra high density interconnect printed circuit boards
Wednesday, September 14, 2016 Further miniaturisation of electronic devices of many kinds and the higher level of integration require a different approach on the manufacturing of printed circuit boards....

Ultra high density interconnect printed circuit boards
Friday, March 16, 2018 Further miniaturisation of electronic devices of many kinds and the higher level of integration require a different approach on the manufacturing of printed circuit boards.


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